Multilayer PCBs
Our possibilities
| Materials: | FR4, Teflon, ceramic |
| Number of layers: | 4-36 |
| Track width / spacing: | 75µm |
| Smallest hole diameter(mech.): | 0,2 mm |
| Copper thickness: | 18-210 µm |
| Basis material thickness: | 0,6-3,2 mm |
| Solder mask: | green, white, blue, red, black |
| Electrical test: | Adapter test, flying probe |
| Manufacturing time: | 3 work days or more |
Example:
FR4, 1.1 mm, 4 layers, 35 µm copper, blue solder mask, immersion Ni/Au surface, min. track width / spacing: 1,25 mm (5 mil)
