IMS/thick copper PCBs
Our possibilities
| Materials: | FR4, IMS |
| Copper thickness: | 18-450 µm |
| Basis material thickness: | 0,6-3,2 mm |
| Solder mask: | green, white, blue, red, black |
| Electrical test: | Adapter test, flying probe |
| Mechanical processing: | milling, scoring |
| Surfaces: | immersion Ni/Au, HAL, immersion Sn, immersion Ag, OSP |
| Manufacturing time: | 5 work days or more |
Example:
IMS, 1.6 mm, single-side , 210 µm copper, 75 µm dielectric, scored, milled, immersion Ni/Au surface, white position print
Example:
FR4, 1.6 mm, double-sided, 450 µm copper, green / blue solder mask, HAL lead surface, white legend print, manufacturing time 8 work days
