HDI PCBs
Our possibilities
| Materials: | FR4, Teflon |
| Number of layers: | 4-36 |
| Min. track width: | 65 µm |
| Min. track spacing: | 65 µm |
| Smallest hole diameter: | mechanical / 0,2 mm Laser / 0,07-0,2 mm |
| Copper thickness: | 18-140 µm |
| Basis material thickness: | 0,6-3,2 mm |
| Solder mask: | green, white, blue, red, black |
| Electrical test: | Adapter test, flying probe |
Example:
FR4, 1.6 mm, 12 layers, blind & buried vias, min. track width / spacing: 0.076 mm (3 mil), Laser bore holes 0.1 mm, mech. bore holes 0.2 mm or more, 35/ 18 µm copper
